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Metallization Processing (See Process Description Below) |
Outer Diameter and Inner Diameter Banding |
| Brush | |
| Screen Printing | |
| Spray | |
| Needle | |
| Base Metallization Materials | Moly Manganese |
| Tungsten Manganese | |
| Moly Tungsten Manganese | |
| Materials for Metallization | Aluminum Oxide |
| Beryllium Oxide (Restrictions Apply) | |
| Metallization Characteristics/Benefits | Low Temperature Firing |
| Universally Applicable | |
| Process Speed | |
| Uniform Coating, Thickness and Density | |
| No substrate deformation | |
| Metallization Equipment | Domestic Furnaces |
| Industry Focus | Department of Defense |
| Department of Energy | |
| Solar Product Manufacturing | |
| Aerospace | |
| Biomedical | |
| Communications | |
| Computer and Electronics | |
| Vacuum Electronics | |
| Medical | |
| Military | |
| Semiconductor | |
| Optical | |
| Intended Applications for Metallization Products | Traveling Wave Tubes |
| Vacuum Electronic Devices | |
| Medical Devices | |
| Photon Machines | |
| Neutron Generators | |
| X-Ray Tubes | |
| Klystrons | |
| High Vacuum Feed Through | |
| Relay Insulators | |
| E-Beam Technology |
| Available Ceramic Compositions | Al2O3 94%,97%,99.5% |
| Available Metallization Materials | Mo/Mn |
| Metallization Thickness | 25±10um |
| Available Plating Materials | Ni/Ag/Au |
| Plating Thickness | 2-10um |